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Intel Secures Second Phase Of Contract With Pentagon

By John F. Heerdink, Jr.

Intel Corporation (INTC) has secured a second-phase contract in a project, positioned to help the U.S. military make more advanced semiconductors within the United States. Intel won the first phase of the contract in 2019.

“I think one of the areas where we can have the most impact on China broadly is re-shoring microelectronics,” stated Ellen Lord, the Pentagon’s chief weapons buyer, to the U.S. Senate Armed Services Committee in a hearing on Thursday.

Under the project, Intel will help the military to develop a prototype of chips using its semiconductor packaging technology at Arizona and Oregon factories. Pieces of chips called “chiplets” from different providers will be assembled into one package, helping fill in more features into a smaller finished product while lowering its power consumption. The deal is being looked at by the Naval Surface Warfare Center, Crane Division.

Intel is among the top three companies in the world (Taiwan Semiconductor Manufacturing Co Ltd and Samsung Electronics Co Ltd being the other two) that is equipped to make advanced computer chips and can work in the U.S.

Intel Corporation (INTC) seeks to expand the boundaries of technology to provide the most amazing experience possible while designing, manufacturing, and selling integrated digital technology globally. To learn more about Intel Corporation (INTC) and to track its progress please visit the Vista Partners Intel Corporation Coverage Page

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(Read Original Story: Intel wins second phase of contract to help Pentagon develop chips in Reuters)


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